Capabilities

Services Offered:

Product concept development.

Product definition and specification.

Component selection and specification.

Schematic capture.

PCB Design.

Signal Integrity Analysis.

DFM, DFT, etc.

Vendor Interfacing.

Prototype build and debug.

Manufacturing Engineering.

Production build in conjunction with our EU or Far Eastern associates.

Product approvals - UL, FCC, CE, etc.

Reverse Engineering: where no CAD data exists or is in an unsupported format.

Product Re-design: for power, cost or size reduction. Also for RoHS conformity.

Obsolescence Management: re-design to workaround component obsolescence issues.

FPGA/CPLD Design.

Manufacturing Engineering.

Gumstix™ expansion designs.

Beagleboard™-based designs.

Technologies:

ARM and X-Scale based systems: Marvell/Intel PXA, TI OMAP, ST, etc.

Microcontrollers: MS430, PSoC, PIC, etc. 

High speed busses: PCI, PCI-X, PCIe, DDR, QDR, etc.

Analogue, Digital and Mixed-signal design..

PCB Layout - High Speed, High Density, High Layer Count,

- Differential Pairs, Controlled Impedance, Matched Length Routing.

Design for Low Power and Portability.

FPGA and CPLD development: Xilinx, Altera, Lattice Semiconductor.