definition and specification.
selection and specification.
DFM, DFT, etc.
build and debug.
build in conjunction with our EU or Far Eastern associates.
approvals - UL, FCC, CE, etc.
Engineering: where no CAD data exists or is in an unsupported
Re-design: for power, cost or size reduction. Also for RoHS
Management: re-design to workaround component obsolescence
ARM and X-Scale based systems:
Marvell/Intel PXA, TI OMAP, ST, etc.
Microcontrollers: MS430, PSoC,
busses: PCI, PCI-X, PCIe, DDR, QDR, etc.
Digital and Mixed-signal design..
PCB Layout - High Speed, High
Density, High Layer Count,
- Differential Pairs, Controlled Impedance, Matched Length
Design for Low
Power and Portability.
FPGA and CPLD development:
Xilinx, Altera, Lattice Semiconductor.
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